|
SPE Susquehanna Newsletter - May 2010Wednesday May 19th, 2010 6:00 PM - An introduction to Laser Direct Structuring Devices (LDS)
Location:
Doc Holiday's (Steakhouse and Saloon) I83
Exit 40A New
Cumberland, PA 17070 (717) 920-3627
Choices: Selection 1 - 10 oz Prime Rib Selection 2 - Grilled Hickory Chicken Dinner (grilled breasts of chicken topped with BBQ sauce, bacon and cheddar jack cheese)
Selection
3 - Other, New Italian Selection. Cost - $25 per person
Agenda: Dinner followed by a presentation by Nicholas DeLuca of SABIC Innovative Plastics.
About
the Author: Nicholas
DeLuca is a product development engineer with SABIC Innovative Plastics
- LNP business - in Exton, PA. He graduated from Drexel University with
a PhD in chemical engineering where he focused on polymer membrane
development for the direct methanol fuel cell. Prior to that,
he was employed at PPL Corporation after completing his undergraduate
degree in chemical engineering from Bucknell University in Lewisburg,
PA. Nick also currently serves on the board of directors of
the local Philadelphia section of SPE as vice-president and golf outing
coordinator. He currently resides in Southeastern PA with wife,
daughter, and pug. Laser Direct Structuring, or LDS, is a process whereby thermoplastic injection molded parts are selectively metallized. This technology creates an alternate route for designing molded interconnect devices, or MIDs, where both mechanical and electrical functions are constructed into one single unit on the surface of a plastic substrate. LDS is a relatively new process that has become increasingly more prevalent in the antenna industry, for instance. LDS has grown over the last few years as an alternate method to manufacture antennas over 2 shot and laser imaging technologies. Laser Direct Structuring technology relies on a material containing an additive that is selectively activated by a focused laser beam irradiating the surface of the part during the formation of the trace on the molded article surface. It is this trace that will then selectively plate forming the MID trace. Some advantages of this technique compared to other MID processing techniques are its processing flexibility, reduction in processing steps, environmental friendliness, and fine-line processing to 150-micron pitch. We will expand on the process behind this technology, material capabilities, and provide some examples of applications using this technology.
If you can attend,
please notify : Ryan Gelotte: ryan.gelotte@tycoelectronics.com or Ollie Bartholomew: opbartho@tycoelectronics.com
|
|
Send mail to webmaster@spesusq.org
with questions or comments about this web site.
|